M2LINK-D2D
Overview
The Die-to-Die interface is a functional block that provides a data interface between two chip dies in the same package. M SQUARE M2LINK D2D Solution compatible with UCIe v1.0 specification contains Die-to-Die adapter layer and physical layer, each layer contains a sideband interface to provide a back-channel for link training and access of registers of the link partner, as shown in Figure 1. This Unique hybrid analog/digital architecture offers low power, compact area and robust performance, making it well-suited for target applications such as High-performance Computing、AI or Multimedia SoC and Die-to-Die interconnection etc.
Highlights
| Compatible with UCIe v1.0 specification |
Single-ended, source synchronous and DDR IO Signaling |
Support 32 bits(16bits TX + 16bits RX) data bus per module for standard package |
High clock frequency, up to 8GHz |
16 Gbps/lane data rate |
512Gbps (256Gbps TX + 256Gbps RX) bandwidth per module for standard package |
High energy efficiency with ~0.8pJ/bit for standard package |
Built in Test and diagnostics (Functional(PRBS), scan, at speed external loopback) |
The advanced process of TSMC 12nm |
© 2023 | M SQUARE Ltd. Shanghai | All Rights Reserved | 上海奎芯集成电路设计有限公司
沪公网安备 31011202014381号
