• 2023.09

    UCIe

    12nm Tapeout


  • 2023.06

    M SQUARE
    Brand open day

  • 2023.05

    LPDDR5X 

    6nm Tapeout

  • 2023.02

    LPDDR4X
    12nm Tapeout

  • 2023.01

    M SQUARE

    joined CCITA

  • 2023.01

    M SQUARE (Chengdu)

    R&D center

  • 2022.12

    Completed

    A round of financing

  • 2022.09

    M SQUARE, Enflame and 

    the other 10 partners established 

    "Data Center XPU Alliance"


  • 2022.08

    Award: 

    Innovative IP Company of the Year

  • 2022.08

    PCIe 4.0 

    Product Release

  • 2022.06

    USB 3.2 12nm
    Tapeout Success

  • 2022.06

    M SQUARE signed MOU 

    with leading AI chip company Enflame.

  • 2022.06

    M SQUARE

    joined USB-IF

  • 2022.04

    M SQUARE

    joined UCIe

  • 2022.03

    The success of 

    the first customer tapeout

  • 2022.02

    PCIe 4.0 12nm
    Tapeout Success

  • 2022.01

    M SQUARE (Beijing)

    subsidiary incorporated

  • 2022.01

    M SQUARE

    joined PCI-SIG

  • 2021.12

    Delivered IP

    to our first customer

  • 2021.12

    M SQUARE

    joined MIPI Alliance

  • 2021.11

    Completed

    pre-A round of financing

  • 2021.09

    M SQUARE(Hefei)

    subsidiary incorporated

  • 2021.08

    M SQUARE(Shanghai)

    headquarters incorporated

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Contact Us

marcom@m2ipm2.com

hr@m2ipm2.com

6th Floor, Building 6-2, No. 519 Shenchang Rd, Minhang, Shanghai, 201107

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marcom@m2ipm2.com

hr@m2ipm2.com

6th Floor, Building 6-2, No. 519 Shenchang Rd,

Minhang, Shanghai, 201107

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